NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED

NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED blends quality and innovation. Our company is forward-thinking and committed to making a big impact on the world through our extensive range of services and goods. Based in Construction Activities, NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED is a non-governmental organization with ₹ 10000.00 in paid up capital and ₹ 100000.00 in allowed capital. On 04-02-2021, it was incorporated. U45400OR2021PTC035524 is NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED 's CIN (Corporate Identification Number).

It was incorporated in the state of OR and is currently found in the subcategory of Private, listed as an Active firm. The registered office address of NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED is Plot No 229/2494, Bhimpur,Unit-VI,BBSR, PS-Capital. This company's registrar is RoC-Cuttack. The most recent financial statement year and annual return for NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED were not available.

NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED was established on 04-02-2021, and has since grown from a tiny startup to a well-known company worldwide. Determination, enthusiasm, and an unending commitment to pushing boundaries have been hallmarks of our path. We have used our knowledge and inventiveness to effect revolutionary change in a number of different industries over the years.

• Address: Plot No 229/2494, Bhimpur,Unit-VI,BBSR, PS-Capital
• Phone:xxxxxxxxxxxxx
• Email:xxxxxxxxxxxx
• State:OR